See more: Devcon 5 Minute® Epoxy Gels
- Thixotropic, nonmigrating gel adhesive with excellent gap filling properties
- High tensile strength
- Good solvent resistance
- Non-sagging adhesive
- Fills gaps to .25 inch
- Fast curing for bond tags on machinery and equipment
- Pack of 1 TUBE
- Manufacturer part number: 14240
- UPC Code: 78143142406
- Chemical resistance was tested by immersion for 30 days at 75 °F, after 7 days room temperature cure; Cured hardness tested according to ASTM D-2240; Cured density tested according to ASTM D1002; Compression strength tested according to ASTM D695; Dielectric strength tested according to ASTM D149
- Adhesive Tensile Shear = 2,500 psi
- Applicable Materials = Wood; Most Metals; Ceramic; Fabric; Concrete; Steel; Aluminum; Copper; Ferrites
- Applications = Multi-Purpose
- Capacity Vol. [Nom] = 25 mL
- Chemical Compound = Epoxy
- Color = Opaque
- Dielectric Strength = 440 V/mil
- Fix Cure Time @ Temp. = 1 h @ 75 °F
- Full Cure Time @ Temp. = 16 h @ 75 °F
- Gap Fill [Nom] = 1/4 in
- Hardness [Nom] = 80 Shore D
- Packing Type = Dual Syringe Tube
- Resistance = Kerosene; Sulfuric Acid-10%; Toluene; Hydrochloric Acid 3%
- Temp. Range [Max] = 200 °F
- Temp. Range [Min] = -40 °F
- Viscosity [Nom] = 150,000 cP
- Working Time [Max] = 7 min
- Working Time [Min] = 4 min
- Working Time [Nom] = 4-7 min
- Wt. = 0.15 lb
- This item is a non-stock item. Lead time may be upwards of 4 weeks.